We specialize in BGA/LGA assembly, rework/reballing, and replacement services for all types of PCB designs. As connections are provided through pads with BGA solder balls on them, the entire package is robust and resistant to potential damages. Defects due to under-etching or ineffective thermal profiles in BGA assemblies are rectified using computer-controlled heating sources and solder extraction tools. PAT has an A.P.E. Sniper - BGA rework system dedicated to perform BGA reworks.
In our BGA’s, the conductors are situated on the underside of the chip carrier and the lead within the chip are shorter in length. This allows them to deliver greater performance and speed than QFP’s (Quad Flat Packages). Our micro BGA assemblies lower the track densities in PCB designs by spreading the contacts over the entire package area. We use X-ray as well as optical inspection equipment to ensure correct component placement and perform solderability checks. Complete support in CAD design, prototyping, and program management is also provided.
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